UV series ultraviolet laser marking machine

UV series ultraviolet laser marking machine

3450.0 USD ($)/Unit

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Product Details:

Design Standard
Power Supply 1500W
Voltage 220 Volt (v)
Weight 80 Kilograms (kg)
Control System PLC
Usage laser marking
Engraving Speed 10000mm/s m/s
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UV series ultraviolet laser marking machine Price And Quantity

Price 3450.0 USD ($)/Unit
Minimum Order Quantity 1 Unit

UV series ultraviolet laser marking machine Product Specifications

Cooling Mode Water Cooling
Color White, grey
Weight 80 Kilograms (kg)
Voltage 220 Volt (v)
Power Supply 1500W
Control System PLC
Applicable Material Other
Width 660 Millimeter (mm)
Design Standard
Length 780 Millimeter (mm)
Usage laser marking
Height 1450 Millimeter (mm)
Engraving Speed 10000mm/s m/s
Working Area 1 Square Millimeter (mm2)
Dimensions 780*600*1450mm Millimeter (mm)

Product Description

1. Class 100 cleanroom enclosure

2. TEM00 fundamental mode output (M2<1.2)

3. High long-term operational stability, 24/7 industrial-grade application

4. Small size and compact structure

5. Standalone and RS232 computer control, external GATE control, external TTL and PWM control

6. LD can be replaced on-site

The LD500 UV laser marking machine uses an advanced enclosed UV laser. Its advanced integrated design and compact size make it particularly suitable for on-the-fly marking on production lines. The German-imported high-speed motor and galvanometer scanning system offer unique advantages such as high marking accuracy and fast processing speed, capable of printing various texts, symbols, patterns, and barcodes on flying objects.

The touch-screen on-the-fly marking system is a laser control system based on an embedded platform, offering convenient operation, high stability, and fast running speed.

High beam quality and a small focused spot enable ultra-fine marking with a minimal heat-affected zone, avoiding damage to the processed material. Therefore, it is mainly used for ultra-fine marking, special material marking and thin film etching, glass marking, material micromachining, wafer cutting, laser rapid prototyping, etc.

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